X-ray investigations off nano structures manufactured by focused ion beam techniques

Nanowires and chains of nanoparticles are of emerging interest in nanoelectronics, nanophotonics and plasmonics. One possible method is the use of a focused ion beam (FIB) that allows to write any pattern directly into the sample to create a particular nano structure. FIB implantation opens the way to manipulate the device structure locally on a length scale of a few 10 nm only and therefore as well as its electronic and optical properties. FIB combines implantation and lithography. The big advantage over other techniques is the reduction of technological steps necessary to make a particular device structure.
We report on strain and defect analysis of lateral nanostructures created in GaAs and Si substrates. The investigations were performed utilizing the method of high resolution X-ray diffraction using grazing incidence and micro focusing techniques at ESRF beamlines.
We have used two different ways to create lateral nanostructures in Si and GaAs, either by creating one or two dimensional patterns by FIB implantation using a liquid metal ion source of Ga or AuGeSi or by focused ion beam synthesis that allows the fabrication of epitaxial CoSi2 layers embedded in silicon. The spot size of the focused ion beam was in the order of 50nm; an ion beam energy in the order of 25keV was used. The whole implanted area had a size of less than 0.2 mm2.