Avoiding amorphization during semiconductor nanostructure ion beam irradiation

Ion beam induced amorphization of semiconductor nanostructures limits the applicability of ion beam processing to semiconductor nanostructures. Here, we present an approach that not only avoids this amorphization but in addition allows to tailor the lateral device dimensions of pillars and fins used in modern GAA and Fin-FET designs. Si nanopillars (diameter: 25–50 nm) have been irradiated by either 50 keV broad beam Si + or 25 keV focused Ne + beam from a helium ion microscope (HIM) at various temperatures using fluences of 2×10 16 cm −2 and higher. While at room temperature strong deformation of the nanopillars has been observed, the pillar shape is preserved above 325 ∘ C. This is attributed to ion beam induced amorphization of Si at low temperatures allowing plastic flow due to the ion hammering effect and surface capillary forces. Plastic deformation is suppressed for irradiation at elevated temperatures. Above 325 ∘ C, as confirmed by diffraction contrast in BF-TEM, the nanopillars remain crystalline, and are continuously thinned radially with increasing fluence down to 10 nm. This is due enhanced forward sputtering through the sidewalls of the pillar, and agrees well with 3D ballistic computer simulations.
Supported by the H-2020 under Grant Agreement No. 688072.