Decomposition kinetics in Ti_1-xAl_xN coatings as studied by in-situ X-ray diffraction during annealing

The influence of the microstructure of the as-deposited cathodic arc evaporated Ti_1-xAl_xN coatings and, in particular, the influence of the intrinsic lattice strains on their thermal stability were investigated by insitu synchrotron high temperature glancing angle X-ray diffraction (HT-GAXRD) experiments up to 850 °C. The microstructure of the as-deposited coatings was adjusted by the bias voltage (UB=−40 V, UB=−80 V and UB=−120 V) and by the [Al]/([Ti]+[Al]) ratio (0.4, 0.5 and 0.6) of the used Ti–Al targets. The microstructure evolution during annealing was described in terms of the phase composition of the coatings, the aluminium content, aluminium distribution and residual lattice strains in fcc-(Ti,Al)N. Independent of the deposition parameters ([Al]/([Ti]+[Al]) ratio and bias voltage), all coatings contained a mixture of fcc-(Ti, Al)N, fcc-AlN and w-AlN after annealing at 850 °C. The [Al]/([Ti]+[Al]) ratio was found to control the amount of fcc-(Ti,Al)N, whereas the bias voltage was mainly responsible for the relative amount of fcc-AlN and w- AlN. Finally, the interplay between lattice strains and the kinetics of the spinodal decomposition of fcc-(Ti, Al)N was illustrated.