Band structure modification in silicon hyperdoped with tellurium for optoelectronics


Band structure modification in silicon hyperdoped with tellurium for optoelectronics

Wang, M.; Liu, F.; Yuan, Y.; Prucna, S.; Berencen, Y.; Rebohle, L.; Skorupa, W.; Helm, M.; Zhou, S.

Abstract

Hyperdoping silicon with chalcogen atoms is a topic of increasing interest due to the strong sub-band gap absorption exhibited by these materials, which can be exploited to develop infrared photodectectors and intermediate band solar cells [1-3]. In our work, tellurium-hyperdoped Si layers have been fabricated by ion implantation followed by either millisecond range flash lamp annealing (FLA) or nanosecond range pulsed-laser melting (PLM). The Rutherford backscattering spectrometry / Channeling (RBS/C) results reveal the high-quality recrystallization of tellurium implanted Si by both FLA and PLM. From the transport measurements, the conductivity increases with increasing tellurium concentration and the high tellurium concentration samples show a finite conductivity if temperature tends to zero. This indicates that the high concentration doping of tellurium induces an insulator-to-metal transition in silicon although tellurium introduces a deep donor in Si. Moreover, the ellipsometry measurements show that the band gap narrows with increasing doping concentration, which could enable silicon-based optoelectronics in the infrared spectral range.

[1] Kim, T. G., et al., Appl. Phys. Lett. 88, 241902 (2006)
[2] Tabbal, M., et al., Appl. Phys. A 98, 589–594 (2010)
[3] Umezu, I., et al., J. Appl. Phys. 113, 213501 (2013)

Keywords: Hyperdoping silicon; Flash lamp annealing; Pulsed-laser melting; Band structure modification

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    The 2016 E-MRS Spring Meeting, 02.-06.05.2016, Lille, France

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